Enhanced electromagnetic wave absorption and thermal conductivity in epoxy composites with a heterostructure-rich 3D MoS2/CMF network framework

文献类型： 外文期刊

第一作者： Geng, Haoran

作者： Geng, Haoran;Zhao, Long;Deng, Jing;Chen, Jingru;Fan, Yihao;Zhao, Qingyun;Liao, Jianhe;Zhao, Yanfang;Qian, Yongxin;Wang, Guizhen;Geng, Haoran;Gui, Hongxing

作者机构：

关键词： Molybdenum disulfide; Carbonized melamine foam; Microwave absorption; Thermal management; Electronic devices packaging

期刊名称：COMPOSITES SCIENCE AND TECHNOLOGY （ 影响因子：9.8； 五年影响因子：9.3 ）

ISSN： 0266-3538

年卷期： 2025 年 261 卷

页码：

收录情况： SCI

摘要： With the widespread application of highly integrated and high-frequency power devices in the electronics field, traditional electronic packaging materials can no longer effectively resist the harm caused by electromagnetic interference and heat accumulation to electronic equipment. To address these challenges, we have successfully constructed a heterostructure-rich dual-level three-dimensional (3D) network framework (MoS2/CMF) by effectively integrating molybdenum disulfide (MoS2) with carbonized melamine foam (CMF). These fillers were then composited with epoxy resin (EP) to develop MoS2/CMF/EP composites exhibiting both electromagnetic wave absorption (EMA) and enhanced thermal conductivity. Specifically, two-dimensional (2D) MoS2 nanosheets with a 1T/2H-phase structure uniformly grew on the surface of CMF, improving the poor impedance characteristics of the 3D carbon structure and increasing heterointerfaces and multiple scattering abilities. Owing to the synergistic effects of attenuation performance and impedance matching, the EP-based MoS2/CMF-1 composite demonstrated an impressive reflection loss value of -64.80 dB and an effective absorption bandwidth of 8.48 GHz, achieved with only a 5 wt% loading. Correspondingly, CST simulation results indicated that when electromagnetic waves are vertically incident on MoS2/CMF-1/EP samples, the radar cross-section (RCS) attenuation value can reach up to 35.4 dBm2. Moreover, the highly interconnected 3D carbon structure of CMF provides broad pathways for phonon transport, resulting in the thermal conductivity of MoS2/CMF-1/EP reaching 0.41 W/m center dot K at room temperature, a nearly 141 % improvement compared to pure EP. This multifunctional EP-based composite, with its high-efficiency EMA and thermal management performance, shows great potential for application in the packaging of highly integrated electronic devices.

分类号：

  • 相关文献
作者其他论文 更多>>

微信小程序