New Immersion Gold Technology for Uniform Au Thickness Distribution (IMPACT-IAAC 2016)

文献类型： 外文期刊

第一作者： Zhang, Jian

作者： Zhang, Jian;Li, Crystal;Hsu, Ivan

作者机构：

期刊名称：2016 11TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT-IAAC 2016)

ISSN： 2150-5934

年卷期： 2016 年

页码：

收录情况： SCI

摘要： Electroless Nickel Immersion Gold (ENIG) is one of the important final finish techniques that is used in the printed circuit board industry. Despite its relatively expensive cost compared to other final finishing processes such as OSP and immersion Tin etc., ENIG has many advantages. The low reactivity of Au can protect the underlying Ni and Cu surfaces from oxidation and keeps the board suitable for long storage time. It provides excellent surface planarity suitable for soldering, especially for tiny parts such as BGA and Flip-Chip, and the surface remains solderable even after multiple reflow cycles. It is useful for contact surfaces such as membrane switches and contact points and may also be used for wire bonding.

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