Room-temperature microstructural evolution of electroplated Cu studied by focused ion beam and positron annihilation lifetime spectroscopy
文献类型: 外文期刊
作者: Yin, K. B. 1 ; Xia, Y. D. 1 ; Zhang, W. Q. 1 ; Wang, Q. J. 1 ; Zhao, X. N. 1 ; Li, A. D. 1 ; Liu, Z. G. 1 ; Hao, X. P.; W 1 ;
作者机构: 1.Nanjing Univ, Natl Lab Solid State Microstruct, Nanjing 210093, Peoples R China
2.Nanjing Univ, Dept Mat Sci & Engn, Nanjing 210093, Peoples R China
3.Nanjing Univ, Dept Mat Sci & Engn, Nanjing 210093
期刊名称:JOURNAL OF APPLIED PHYSICS ( 影响因子:2.546; 五年影响因子:2.389 )
ISSN: 0021-8979
年卷期: 2008 年 103 卷 6 期
页码:
收录情况: SCI
摘要: Focused ion beam (FIB) microscopy was used to obtain the time dependent transformation fraction and positron annihilation lifetime spectroscopy (PALS) was employed to analyze the vacancy-type defects in electroplated copper (Cu) during room-temperature microstructrual evolution. It was found that PALS is more sensitive than FIB to show the room-temperature microstructual evolution of electroplated Cu at the first stage of self-annealing. The majority of defects in electroplated Cu are dislocation-bound vacancies and vacancy clusters. Both the size and the concentration of the defects are similar for the two samples at the completion of electroplating. During the incubation time, the mean size of vacancy-type defects increases. After the onset of visible grain growth, the size of vacancy-type defects decreases. The detail evolutions of defects differ with the two samples. The role of the evolution of codeposited species was also discussed. (C) 2008 American Institute of Physics.
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The kinetics and mechanism of room-temperature microstructural evolution in electroplated copper foils
作者:Yin, K. B.;Xia, Y. D.;Chan, C. Y.;Zhang, W. Q.;Wang, Q. J.;Zhao, X. N.;Li, A. D.;Liu, Z. G.;Bayes, M. W.;Yee, K. W.
关键词:electroplated copper;self-annealing;microstructural evolution;activation energy