文献类型： 外文期刊

作者： Yin, K. B. ¹ ; Xia, Y. D. ² ; Chan, C. Y. ² ; Zhang, W. Q. ² ; Wang, Q. J. ² ; Zhao, X. N. ² ; Li, A. D. ³ ; Liu, Z. G.;

作者机构： 1.Nanjing Univ, Dept Mat Sci & Engn, Natl Lab Solid State Microstruct, Nanjing 210093, Peoples R China

2.Nanjing Univ, Dept Mat Sci & Engn, Natl Lab Solid State Microstruct, Nanjing 210093, Peoples R China; Rohm & Haas Elect Mat Asia Ltd, Fanling, Hong Kong, Peoples R China

3.Nanjing Univ, Dept Mat Sci & Engn, Natl Lab Solid State Microstruct

关键词： electroplated copper;self-annealing;microstructural evolution;activation energy

期刊名称：SCRIPTA MATERIALIA （ 影响因子：5.611； 五年影响因子：5.898 ）

ISSN： 1359-6462

年卷期： 2008 年 58 卷 1 期

页码：

收录情况： SCI

摘要： The room-temperature microstructural evolution of 18 mu m thick electroplated copper deposits was investigated by cross-sectional focused ion-beam microscopy. The fraction of transformed volume as a function of annealing time was measured. The transformation was found to start and nucleate from the bottom of the foils and then propagate towards the free surfaces. Based on differential scanning calorimetry results, the activation energy for grain growth is 0.85 eV atom(-1). The mechanism of the grain growth is also discussed. (C) 2007 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.